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Gerber · BOM · CPLProject inputs
DIP & SOLDERING
DIP Assembly & Hand Soldering
DIP Assembly & Hand Soldering with project-specific engineering review, controlled manufacturing, inspection, traceability and delivery.
PROJECT CONTROL
From project input to controlled delivery
Four verifiable checkpoints connect engineering, manufacturing, inspection and delivery.02
DFM · FAI · pilotEngineering & NPI
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SPI · AOI · X-RayProcess inspection
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Test · box build · recordsDelivery scope
SERVICE BOUNDARIES
Scope and delivery controls
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工艺按器件匹配
根据器件形态、孔位、热容量、焊接可达性和外观要求确定插件与焊接方式。
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关键器件确认
极性、高度、方向、端子装配和特殊辅料在首件阶段确认。
03
焊后检查与测试
外观、焊点、剪脚、清洁和项目功能检查按受控标准执行。
PROJECT INPUTS
Project fit and required data
Scope, suitable projects, process, equipment, quality controls and required customer data are confirmed for each project.
Service scope
Process, sourcing, testing, assembly and delivery boundaries are defined during review.
Core equipment
Printing, 3D SPI, placement, reflow, AOI, X-Ray, FAI, LCR and project testing as applicable.
Quality control
Incoming, first article, in-process, final and outgoing checks with project traceability.
Customer data
Gerber, BOM, CPL / PnP, quantity, test, programming, packaging and target delivery.
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FAQ
Questions about DIP Assembly & Hand Soldering
Project-specific limits and standards are confirmed during review.
Gerber, BOM, CPL / PnP, quantity, test, programming, packaging and target delivery requirements are recommended.